Research on the System of Down-hole Engineering Parameters Measure While Drilling
Hu Ze1, Xie Xiaohui1, Ge Liang1, Chen Ping2, Li Junlan3, Zeng Qiang1
Identifiers and Pagination:Year: 2014
First Page: 149
Last Page: 153
Publisher Id: TOPEJ-7-149
Article History:Received Date: 6/06/2014
Revision Received Date: 8/10/2014
Acceptance Date: 8/12/2014
Electronic publication date: 31/12/2014
Collection year: 2014
open-access license: This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 International Public License (CC-BY 4.0), a copy of which is available at: https://creativecommons.org/licenses/by/4.0/legalcode. This license permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
The down-hole engineering parameters measure while drilling system is an important vehicle to monitor the down-hole parameters in the drilling process. By adopting it, the drilling engineer can grasp the engineering parameters of annulus pressure, drilling pressure, torque, temperature and so on. In real-time way, it can be used to learn and analyze the state of down-hole. The down-hole engineering parameters measure while drilling system adopts the Infineon XC886 MCU as the core chip, and uses the high reliability technology to complete the engineering parameters measuring dual system. The down-hole engineering parameters measure while drilling system has advantages of small size, low power consumption, vibration resistance and high temperature flexibility. Once the overall system is completed, to realize its engineering application, laboratory test, high temperature test, vibration test and spot test are made to check the function and the reliability of the system, and the field data in the spot test are successfully obtained.